Semiconductor group :   Package outlines. Reference guide 

 - Missouri :   Texas instruments,   1998. 
 - 8-36 p. 
<br/><br/>General information;Arrays;Plastic surface-mount;Plastic through-hole;Ceramic surface-mount;Ceramic throug-hole;Memory modules;Appendix 
<br/><br/><label>Subjects--Topical Terms: </label><br/>CIRCUITOS INTEGRADOS<br/>PACKAGE
<br/><br/><label>Universal Decimal Class. No.: </label>REFERENCIA